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Electrically conductive adhesive (Shieldokit)
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- EMI coatings, conductive glues, thermal, lubricants and seals
- Conductive glue
- Electrically conductive adhesive (Shieldokit)
Shieldokit creates an electrically and thermally conductive connection between components (electrically conductive adhesive). One of the applications is EMI shielding. The conductive glue cures at room temperature and has excellent filling properties. This conductive glue can be used to fill uneven surfaces because of its viscosity, which is comparable to peanut butter.
The product consists of a two-component epoxy-based glue containing 65% silver. It is a paste which can be applied to metals (copper, aluminium, stainless steel, brass, etc.), ceramics and most plastics.
Structure
Shieldokit is a solvent-free, silver pigmented adhesive, based on a two-component epoxy resin.
Special characteristics
The kit creates a strong connection with excellent conductivity. It is designed to connect temperature-sensitive components.
| Part number | Description | |
|---|---|---|
| 3980-14 | Electrically conductive adhesive (Shieldokit) 14 gram |
Used for
- Gluing components that cannot be soldered
- Connections that require excellent electrical conductivity
- Connections that have to be thermally conductive
- Repairing non-solderable components
- Gluing objects to a plastic enclosure where an electrically conductive linkage is needed
- Restoration of flat cables, SMD components, etc.
How to use
Read the product SDS for more detailed instructions before using this product. Clean the substrate with Isopropyl Alcohol so the surface is free of oils, dust, and other residues. Dispense material on a mixing surface or container, and thoroughly mix parts A and B together.
Once Parts A and B are mixed, the epoxy starts curing chemically. You can apply the mixed paste for 35 minutes at room temperature to apply it, spread it, position components, and work with the material before it becomes too thick or starts hardening. After this working time the viscosity increases, application becomes difficult, and the material may no longer wet surfaces properly. When done clean nozzle to prevent contamination and material buildup. Replace the cap on the syringe.
Allow to cure at room temperature for 6 hours, or cure the adhesive in an oven at one of these time/temperature options:
10 min @ 65 ˚C
5 min @ 80 ˚C
Storage
Store between 16 and 27 ˚C in a dry area, away from sunlight (see SDS). To maximize shelf life, recap product firmly when not in use.
Electrically and thermally conductive connection between heat-sensitive components that cannot be soldered

The glue can be used for creating a conductive edge for convenient mounting
Electrically conductive connection between a conductive window and a plastic enclosure, ensuring full EMI-shielding integrity
Cured properties
| Colour | Silver grey | - |
|---|---|---|
| Density | 2.5 g/ml | Hydrostatic Weighing |
| Service Temperature Range | -50-150 ˚C | - |
| Resistivity | 1.8 x 10-3 Ω-3;cm | ASTM D257 |
| Hardness | 78 D | ASTM D2240 |
| Tensile Strength | 13 N/mmm2 | ASTM D638 |
| Compressive Strength | 69 N/mm2 | ASTM D695 |
| Lap Shear | 5.6 N/mmp2 (Stainless steel) 5.1 N/mm2 (Aluminum) |
ASTM D1002 |
| Glass Transition Temperature (Tg ) | 35 ˚C | ASTM E1545 |
| Coefficient of Thermal Expansion (CTE) |
58 ppm/˚C (Prior Tg ) 234 ppm/˚C (After Tg ) |
ASTM E831 |
| Thermal Conductivity @ 25 ˚C Specfic Heat Capacity @ 25 ˚C Thermal Diffusivity @ 25 ˚C |
1.5 W/(m·K) 0.7 J/(g∙K) 0.9 mm2 /s |
ASTM E1461 |
| Weight Loss @ 155 °C (600 hrs) | 2.9 % | - |
Liquid properties
| Density | 2.4 g/mL (Mixed) 2.5 g/mL (A) 2.3 g/mL (B |
ASTM D1475 |
|---|---|---|
| Viscosity @ 25 ˚C | 130 Pa∙s (A) 30 Pa∙s (B) |
Brookfield Engineering labs Inc. IPCTM-65- Method 2.4.24.4 |
| Mix Ratio | 1:1 (Volume) 1.1:1 (Weight) |
- |
| Working Time a | 35 min | - |
| Set Time a | 40 min | - |
| Peak Exotherm b | 28 °C | ASTM D2471 |
| Shelf Life | 2 years after invoice date | - |
b Based on a 2 ml sample in a fixed container geometry.